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4/19/2011
06:46 PM
Fritz Nelson
Fritz Nelson
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RIM BlackBerry PlayBook Teardown

UBM TechInsights takes a look under the hood at yet another tablet. Inside RIM's new BlackBerry tablet is the TI OMAP 4 processor, a six-axis gyro and some other fun hardware goodies.
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Major ICs identified on the BlackBerry PlayBook. Interestingly, there is no epoxy around the main components. Typically epoxy is used to secure the device to the board and prevent the solder from cracking if a user drops the device. There was epoxy around A5 in the iPad2, and around the nVidia processor in the Motorola Xoom. Did RIM rush the construction of the boards? Or does the company have that much faith in the solder? RIM did make the PlayBook very dense, so maybe it will take the shock.

See Also:

RIM's BlackBerry Bridge To Nowhere

Review: BlackBerry PlayBook Not Ready For The Enterprise

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