Fujitsu To Commercialize Carbon Nanotubes - InformationWeek

InformationWeek is part of the Informa Tech Division of Informa PLC

This site is operated by a business or businesses owned by Informa PLC and all copyright resides with them.Informa PLC's registered office is 5 Howick Place, London SW1P 1WG. Registered in England and Wales. Number 8860726.

IoT
IoT
News
News
12/5/2005
07:46 AM
50%
50%

Fujitsu To Commercialize Carbon Nanotubes

The technology represents a major advance for practical applications that take advantage of the thermal conductivity of carbon nanotubes, especially in mobile communications, company researchers claim.

LONDON — Fujitsu has developed carbon nanotube-based heat sinks for use in high frequency power amplifiers targeted at mobile communications infrastructure, company scientists revealed at the International Electron Devices Meeting in Washington, D.C.

The researchers said the use of carbon nanotubes as heat sinks for high-frequency high power amplifiers achieves heat dissipation and high amplification simultaneously.

They also claim the technology represents a major advance in developing practical applications that take advantage of the thermal conductivity of carbon nanotubes.

Fujitsu said the work, part of a project in collaboration with the Japan Fine Ceramics Center, is likely to see commercialization in three years’ time.

The company said the focus now is to refine the site density of carbon nanotubes in bumps to enable further improvements in heat dissipation prior to developing the high-frequency, high power flip-chip amplifiers using carbon nanotube bumps.

The researchers say the motivation for the research was that at higher frequencies, amplifiers using the traditional “face-up” structure suffer from reduced amplification. This is due to inductance from the metal wire through which the electrical current flows from the electrode of the transistor chip to the electrode of the package.

Flipping the chip over and connecting the chip electrode and the package electrode with short metallic bumps made from gold or other metals, is a solution to the problem. However, for use in high power amplifiers, conventional metallic bumps have proven inadequate in dissipating the high levels of heat generated by high-power transistors.

Key advances claimed by the researchers include novel techniques to grow carbon nanotubes. They used an iron catalyst coating to grow carbon nanotubes to a vertical length of at least 15 micrometers on the wafer substrate. Usually, bumps for flip-chips are required to have a length of at least 10 micrometers.

They have also developed new methods to connect the carbon nanotube bump to the flip-chip. Fujitsu said the most recent research has yielded flip-chip structures with heat dissipation equivalent to conventional face-up structures, ground inductance that is reduced by more than half, and an increase in amplification of at least 2 dB at frequencies of 5GHz or greater.

We welcome your comments on this topic on our social media channels, or [contact us directly] with questions about the site.
Comment  | 
Print  | 
More Insights
The State of Cloud Computing - Fall 2020
The State of Cloud Computing - Fall 2020
Download this report to compare how cloud usage and spending patterns have changed in 2020, and how respondents think they'll evolve over the next two years.
News
How GIS Data Can Help Fix Vaccine Distribution
Jessica Davis, Senior Editor, Enterprise Apps,  2/17/2021
Commentary
Graph-Based AI Enters the Enterprise Mainstream
James Kobielus, Tech Analyst, Consultant and Author,  2/16/2021
Slideshows
11 Ways DevOps Is Evolving
Lisa Morgan, Freelance Writer,  2/18/2021
Register for InformationWeek Newsletters
Video
Current Issue
2021 Top Enterprise IT Trends
We've identified the key trends that are poised to impact the IT landscape in 2021. Find out why they're important and how they will affect you.
White Papers
Slideshows
Twitter Feed
Sponsored Live Streaming Video
Everything You've Been Told About Mobility Is Wrong
Attend this video symposium with Sean Wisdom, Global Director of Mobility Solutions, and learn about how you can harness powerful new products to mobilize your business potential.
Sponsored Video
Flash Poll