IBM researchers, along with scientists at the California Institute of Technology, have discovered that the tiny components that run along a chip's silicone surface will self-adhere to previously laid down DNA patterns.
"The cost involved in shrinking features to improve performance is a limiting factor in keeping pace with Moore's Law and a concern across the semiconductor industry," said Spike Narayan, Science & Technology manager at IBM's Almaden research lab in San Jose, CA.
Moore's Law holds that computing power at a given cost doubles every two years. Gains in chip speeds over the past two decades have largely been obtained by shrinking components. But with some parts now at microscopic levels, engineers are having an increasingly difficult time building on previous work.
Narayan said IBM and Caltech's breakthrough in DNA-based chip design could help maintain Moore's Law well into the future.
"The combination of this directed self-assembly with today's fabrication technology could lead to substantial savings in the most expensive and challenging part of the chip-making process," said Narayan.
IBM plans to publish a paper on the research in the September issue of Nature Nanotechnology.
InformationWeek Analytics has published an analysis of why automation is good for IT.
Stay connected and informed by visiting the CA Solutions Center Community!

Become a member today for instant access to free InformationWeek research, expert advice, peer perspectives, and more on the following topics:
- Application Performance Management (APM)
- Security Management
- Mainframe 2.0
- IT Automation
- Service Assurance
Also, visit our Government and Financial Services groups to see how these technologies apply specifically to those industries.
NOTE: Offer valid for U.S., U.S. possessions, & Canada only.