The Socket G3 Memory Extender technology is planned for the processor platform ecosystem in 2009. The advancement is expected to boost the performance of enterprise-class servers, such as those used for databases, virtualization, and multi-core computing.
The G3MX, which supports the DDR3 memory specification, is being developed with IC vendors IDT and Inphi, which plan to integrate G3MX components within their device portfolios.
"True to our collaborative nature, we worked closely with memory technology experts to develop G3MX, as an easy, cost-effective way for customers to attain faster access to memory or additional memory to enable increased performance for complex and emerging applications and environments," Randy Allen, corporate VP of AMD's Server/Workstation Division, said in a statement.
G3MX provides a DDR3-based means of increasing total memory in a server system, thereby increasing flexibility in computing, AMD said. The chipmaker plans to introduce the technology in its next-generation architecture enhancements in 2009.
In about two years, AMD plans to ship its first chips built using a 45-nanometer manufacturing process, which builds a smaller chip with less power leakage than its 65nm and 90nm predecessors. The 45nm process is widely seen as the next great advancement in the semiconductor industry.
AMD rival Intel plans to ship in the second half of this year a 45nm Xeon processor codenamed Penryn. The new processor line is expected to eventually cross product lines from desktop to server, workstation, and mobile. The line will include dual-core and quad-core chips.
While Intel has been shipping quad-core chips since late last year, AMD is scheduled to ship its first such products this year. The desktop version will be called Phenom, and the server version is codenamed Barcelona.